PTFE(Teflon) Labware
Custom PTFE Semiconductor Wafer Cleaning Basket Corrosion Resistant Low Background Lab Rack
Item Number : PL-CP267
Price varies based on specs and customizations
- Material Composition
- High-Purity Virgin PTFE
- Chemical Compatibility
- Universal (including HF and Piranha)
- Fabrication Method
- Full Custom CNC Machining
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Product Overview




This high-purity cleaning system represents the pinnacle of fluoropolymer engineering, specifically designed to meet the rigorous demands of the semiconductor and microelectronics industries. Constructed entirely from premium-grade polytetrafluoroethylene (PTFE), this equipment provides an inert environment for critical wafer processing, ensuring that sensitive substrates are protected from metallic contamination and chemical degradation. Its robust architecture is tailored for high-stakes laboratory environments where chemical purity and structural integrity are non-negotiable.
The primary use cases for this unit revolve around advanced wafer cleaning protocols, including RCA cleans, Piranha etches, and hydrofluoric acid (HF) treatments. By utilizing a low-background material, the system minimizes trace element interference, making it an essential tool for facilities focused on sub-nanometer fabrication and high-sensitivity trace analysis. This equipment is particularly valuable in semiconductor fabs, GaAs processing centers, and research laboratories dedicated to thin-film deposition and photovoltaic development.
Built to withstand the most aggressive chemical reagents and thermal cycling, this unit delivers unparalleled reliability. The inherent properties of the fluoropolymer material ensure that the rack remains dimensionally stable and chemically passive even after prolonged exposure to concentrated acids and bases. Procurement teams can invest in this system with full confidence, knowing that its performance is backed by precision CNC manufacturing and a deep understanding of high-purity fluid dynamics, ensuring consistent results across thousands of cleaning cycles.
Key Features
- Superior Chemical Inertness: This system is manufactured from high-density PTFE, providing near-universal resistance to acids, bases, and organic solvents, including Piranha solution and concentrated HF, which typically compromise standard laboratory equipment.
- Ultra-Low Trace Element Background: The material selection ensures minimal leaching of metallic ions, preserving the integrity of semiconductor wafers and preventing cross-contamination in high-sensitivity trace analysis workflows.
- Optimized Fluid Dynamics: The open-architecture design of this rack facilitates the rapid displacement of process chemicals and promotes efficient drainage, significantly reducing the risk of residual film formation or chemical carryover between stages.
- Hydrophobic Surface Properties: With a naturally high contact angle, the fluoropolymer surfaces facilitate quick drying and minimize liquid retention, enhancing the efficiency of spin-drying and overflow rinsing processes.
- High Thermal Stability: This unit maintains its structural integrity and mechanical properties across a wide temperature range, allowing for consistent performance in both cryogenic and high-temperature chemical baths.
- Precision CNC Fabrication: Each component is crafted using advanced computer numerical control machining, ensuring tight tolerances for wafer slots and structural supports, which prevents mechanical stress on delicate substrates.
- Non-Stick and Self-Cleaning: The low surface energy of the material prevents the adhesion of particulates and process byproducts, making the cleaning of the equipment itself a simple and effective process.
- Customizable Geometry: Recognizing that every fab has unique requirements, the design of this system is fully adaptable, allowing for specific wafer counts, diameters, and spacing intervals to match existing automated or manual workflows.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| RCA Cleaning Process | Used during SC-1 and SC-2 sequences to remove organic residues and metallic contaminants from silicon wafers. | Prevents re-contamination due to the ultra-pure, low-leachable material surface. |
| Piranha Etching | Handling wafers in a mixture of sulfuric acid and hydrogen peroxide for photoresist removal. | Exceptional resistance to aggressive oxidative environments without structural degradation. |
| Hydrofluoric Acid Dipping | Removing native oxide layers from silicon substrates using concentrated or buffered HF solutions. | Total immunity to HF attack, ensuring long-term equipment survival and process purity. |
| Post-CMP Rinsing | Cleaning wafers after Chemical Mechanical Polishing to remove slurry particles and chemicals. | Rapid drainage and non-stick properties prevent slurry particles from adhering to the basket. |
| Photolithography Development | Supporting substrates during the developing and stripping of photoresist layers. | High dimensional stability ensures precise alignment and handling during critical lithography steps. |
| Trace Analysis Preparation | Cleaning labware and containers used in ICP-MS and other high-sensitivity analytical techniques. | Extremely low background levels ensure the highest accuracy in detecting trace metallic impurities. |
| GaAs Wafer Processing | Handling compound semiconductor wafers through specialized etching and rinsing cycles. | Gentle support structures prevent breakage of brittle compound semiconductor materials. |
| Ultrasonic Cleaning | Functioning as a submerged carrier during high-frequency acoustic cleaning cycles. | Efficiently transmits ultrasonic energy while protecting wafers from mechanical contact with the tank. |
Technical Specifications
| Feature | Specification Details for PL-CP267 |
|---|---|
| Model Identifier | PL-CP267 |
| Primary Material | High-Purity Virgin PTFE (Polytetrafluoroethylene) |
| Manufacturing Process | 100% Precision CNC Machined (No injection molding residues) |
| Chemical Resistance | Full resistance to HF, H2SO4, HNO3, HCl, KOH, and Organic Solvents |
| Temperature Range | -200°C to +260°C (-328°F to +500°F) |
| Surface Finish | Smooth, low-porosity finish to minimize particle entrapment |
| Configuration Options | Fully Customizable (Wafer size, slot width, slot pitch, handle design) |
| Wafer Compatibility | Suitable for 2", 3", 4", 6", 8", and 12" wafers or custom dimensions |
| Drainage Design | V-bottom or U-bottom slot profiles available for optimized fluid runoff |
| Background Levels | Specifically processed for sub-ppb metallic impurity requirements |
Why Choose This Product
- Bespoke Engineering Excellence: Every unit is treated as a custom project, allowing us to tailor the dimensions, slot configurations, and handle styles to your specific semiconductor fab requirements or laboratory setup.
- Unmatched Material Purity: We utilize only the highest grade of virgin PTFE, ensuring that your cleaning processes are free from the fillers, pigments, or recycled materials found in commodity-grade labware.
- Extreme Durability and Longevity: Unlike molded alternatives that may stress-crack or warp over time, our CNC-machined PTFE racks offer superior mechanical strength and long-term dimensional stability in harsh environments.
- Expertise in Fluoropolymers: With a singular focus on PTFE and PFA, our engineering team understands the nuances of material expansion, chemical permeability, and surface tension better than generalist manufacturers.
- Rapid Customization Response: Our end-to-end CNC fabrication capabilities allow us to move from design approval to delivery quickly, ensuring your production lines or research projects remain on schedule.
Our commitment to precision and purity makes this system the preferred choice for industry leaders who cannot compromise on process yields. Contact our technical sales team today to discuss your specific dimensions and receive a custom quote tailored to your high-purity cleaning needs.
Trusted by Industry Leaders
Product Datasheet
Custom PTFE Semiconductor Wafer Cleaning Basket Corrosion Resistant Low Background Lab Rack
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