PTFE(Teflon) Labware
High Purity PTFE Wafer Carrier Semiconductor Flower Basket for Corrosion Resistant Silicon Processing Custom Sized Labware
Item Number : PL-CP338
Price varies based on specs and customizations
- Material Composition
- High-Purity Polytetrafluoroethylene (PTFE)
- Chemical Resistance
- Universal (pH 0-14, highly oxidative/acidic)
- Customization Capability
- Fully Bespoke Dimensions, Capacity, and Handles
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Product Overview
This high-purity fluoropolymer carrier system is engineered specifically for the rigorous demands of the semiconductor and microelectronics industries. Designed to hold silicon wafers securely during critical wet processing stages, this equipment provides an unparalleled combination of chemical inertness and structural integrity. By utilizing premium-grade Polytetrafluoroethylene, the unit ensures that delicate substrates remain free from metallic and organic contamination, which is essential for maintaining high yield rates in advanced node fabrication.
Primarily utilized in cleanroom environments for wafer cleaning, etching, and photolithography, this system serves as a cornerstone for laboratory and industrial-scale silicon processing. The equipment is compatible with a wide array of aggressive chemistries, from acidic etching baths to alkaline cleaning solutions. Its robust construction allows it to withstand the repetitive thermal and chemical cycles common in integrated circuit manufacturing, making it a reliable choice for research facilities and high-volume production lines alike.
Industrial buyers can have absolute confidence in the performance of this unit under the most demanding conditions. Every component is crafted with a focus on precision and durability, ensuring that the carrier maintains its geometric stability even when exposed to fluctuating temperatures and corrosive vapors. By prioritizing material purity and mechanical reliability, this system minimizes downtime and process variability, providing a stable platform for the most sensitive semiconductor fabrication procedures.
Key Features
- Exceptional Chemical Inertness: Constructed from high-performance fluoropolymers, this system is virtually unaffected by most industrial chemicals, including hydrofluoric acid, sulfuric acid, and strong bases used in RCA cleaning processes.
- High-Purity Material Composition: The use of premium PTFE prevents the leaching of trace metal ions or organic contaminants into processing baths, ensuring the integrity of sub-nanometer semiconductor architectures.
- Thermal Stability and Resilience: With a melting point of 327°C and a high heat deflection temperature, the unit maintains its structural form and mechanical properties throughout high-temperature cleaning and drying cycles.
- Fully Customizable Geometry: This equipment is manufactured to order, allowing for bespoke dimensions, slot widths, and pitch configurations to accommodate various wafer sizes and specific robotic handling requirements.
- Advanced Fluid Dynamics: The open-frame "flower basket" design is engineered to maximize fluid flow and drainage, reducing the risk of chemical entrapment and ensuring uniform exposure of the wafer surface to processing agents.
- Low Friction Surface Finish: The naturally low coefficient of friction of the material prevents scratching or abrasion of the silicon substrates during loading and unloading, protecting the delicate wafer edges.
- Integrated Handling Options: Available with ergonomic handles and dedicated zones for precision tweezers, the system facilitates safe and secure manual or automated transport within the cleanroom.
- Minimal Moisture Absorption: With a water absorption rate of nearly zero (0.01%), the equipment dries rapidly and prevents cross-contamination between different chemical baths in a multi-step process.
- Plasma Resistance: The material's unique crystalline structure provides superior stability even when exposed to plasma environments, a critical advantage in post-etch cleaning and photoresist stripping.
- Robust CNC Fabrication: Each unit is produced using advanced CNC machining techniques, ensuring high dimensional accuracy and a smooth, burr-free finish that meets stringent industrial standards.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| RCA Cleaning (SC-1/SC-2) | Used to hold wafers during the removal of organic residues and metallic contaminants using hot peroxide and acid solutions. | Prevents trace metal contamination and survives high-temperature alkaline baths. |
| Hydrofluoric Acid (HF) Etching | Supporting silicon wafers during the removal of native oxide layers or sacrificial oxide structures. | Complete resistance to HF, which would dissolve glass or degrade most other plastics. |
| Piranha Etching | Handling substrates in a mixture of sulfuric acid and hydrogen peroxide to remove heavy organic photoresist. | Maintains structural integrity under the extreme oxidative stress and heat of piranha solutions. |
| Photolithography Stripping | Carrying wafers through solvent or plasma-based stripping processes to remove developed photoresist layers. | Chemical stability under solvent exposure and resistance to plasma-induced degradation. |
| CMP Post-Process Rinsing | Holding wafers during the critical cleaning steps following Chemical Mechanical Planarization. | Low friction prevents surface defects on freshly polished wafers while maximizing rinse efficiency. |
| Ultrasonic/Megasonic Cleaning | Securely positioning wafers within cleaning tanks while subjected to high-frequency sound waves. | Dampens vibrations while ensuring the wafers remain properly spaced for uniform cleaning action. |
| Compound Semiconductor Prep | Specialized processing for GaAs or GaN wafers used in high-frequency and power electronics. | High purity ensures that delicate compound semiconductors are not poisoned by material impurities. |
| Sample Storage & Transport | Providing a safe, chemically clean environment for wafers between processing steps or during transport. | Non-reactive surface ensures no long-term chemical interaction with the stored substrates. |
Technical Specifications
| Specification Category | Parameter | Detail for PL-CP338 |
|---|---|---|
| Model Identifier | Item Number | PL-CP338 |
| Material Properties | Base Material | High-Purity Polytetrafluoroethylene (PTFE) |
| Specific Gravity | 2.10 - 2.20 g/cc | |
| Melting Point | 327°C (621°F) | |
| Water Absorption (24hr) | 0.01% | |
| Thermal Performance | Heat Deflection Temperature | 120°C (248°F) |
| Maximum Service Temp | 260°C (Continuous) | |
| Mechanical Performance | Tensile Strength | 2,990 - 4,970 psi |
| Flexural Strength | 2,490 psi | |
| Hardness (Shore D) | 55D | |
| Coefficient of Friction | 0.110 | |
| Electrical Properties | Dielectric Constant | 2.1 |
| Configuration Options | Dimensional Sizing | Fully Customizable (Bespoke) |
| Wafer Capacity | Custom per user requirement | |
| Slot Spacing/Pitch | Tailored to process specifications | |
| Accessories | Optional handles, tweezers, and locking bars | |
| Manufacturing Method | Fabrication Type | Precision CNC Machined Custom Product |
Why Choose This Product
Choosing this PTFE carrier system means investing in superior material science and engineering precision. Unlike standard molded components, our units are CNC-machined from high-density fluoropolymer stock, ensuring a level of dimensional stability and surface finish that is essential for high-yield semiconductor manufacturing. The inherent properties of our PTFE—ranging from its near-zero moisture absorption to its universal chemical resistance—provide a level of process security that commodity plastics simply cannot match.
Our commitment to customization ensures that you never have to compromise on your process flow. Whether you require a specific slot density for optimized fluid dynamics or integrated handles for robotic pick-and-place compatibility, our engineering team can deliver a solution tailored to your exact specifications. This bespoke approach, combined with our rigorous quality control, guarantees that every unit performs reliably for years, even in the harshest wet-bench environments.
We understand that in the semiconductor industry, every detail matters—from the purity of the material to the precision of the slot pitch. By focusing exclusively on high-performance fluoropolymers and utilizing advanced fabrication techniques, we provide the tools necessary for modern laboratories and fabs to push the boundaries of technology. Our products are designed for durability, operational consistency, and maximum contamination control.
For a technical consultation regarding your specific wafer handling requirements or to request a quote for a custom-sized solution, please contact our engineering team today. 我们提供专业的定制服务，确保产品完全符合您的工艺需求。
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