PTFE (polytetrafluoroethylene) ptfe teflon O-rings are widely used in extreme temperature applications due to their exceptional thermal stability. The standard operating range for these seals spans from cryogenic conditions up to high-temperature industrial environments, with a low limit of -200°C (-328°F) and a high limit of 250°C (482°F). This broad range makes them suitable for aerospace, chemical processing, and semiconductor equipment where temperature resistance is critical.
Key Points Explained:
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Standard Temperature Range
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Low Limit: -200°C (-328°F)
PTFE maintains flexibility and sealing integrity even in cryogenic conditions, making it ideal for liquid nitrogen or oxygen systems. -
High Limit: 250°C (482°F)
Continuous exposure beyond this threshold may cause gradual degradation, though short-term spikes (e.g., during sterilization) can sometimes be tolerated.
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Low Limit: -200°C (-328°F)
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Performance Considerations
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Encapsulated vs. Solid PTFE O-rings
Teflon-encapsulated variants (with silicone/FKM cores) typically have a narrower range (-60°C to +230°C) due to core material limitations. -
Thermal Expansion
PTFE’s low coefficient of thermal expansion reduces leakage risks during temperature fluctuations compared to elastomers.
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Encapsulated vs. Solid PTFE O-rings
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Application-Specific Factors
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Chemical Exposure
While PTFE resists most chemicals, aggressive media (e.g., molten alkali metals) may alter its temperature limits. -
Mechanical Stress
High pressures or dynamic loads can reduce effective temperature resistance; consult manufacturer data for combined stress scenarios.
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Chemical Exposure
For critical applications, always verify limits with supplier specifications, as filler materials (e.g., glass or graphite) may modify these ranges. How might your operational environment influence the choice between pure PTFE and encapsulated designs?
Summary Table:
| Property | PTFE O-Ring Specifications |
|---|---|
| Standard Low Limit | -200°C (-328°F) |
| Standard High Limit | 250°C (482°F) |
| Encapsulated Variants | -60°C to +230°C (silicone/FKM cores) |
| Key Advantage | Cryogenic to high-heat stability |
| Critical Consideration | Chemical exposure & mechanical stress |
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